Datenblatt für i.MX RT600








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Figure 3 Figure 4 Figure 5 Figure 4
and
Table 4






























_vsus ,
Table 5
Table 5
e Table 5
Table 5
Secfion 1 ‘Power Seguencing"


Table 6
Table 6
Default stale,
Semion 10.12.1
Figure 3

Figure 4
Table 8
Figure 3 “Block diagram
overview"
Semion 10.125 “Device overview"
Section 10.126 “Cortex-M33 Memory overview"
Section 10.127 “Shared RAM detail"
Section 10.128 “APB Qerigherals"
Section 10.129 “AHB gerigherals"
Section 10.12.10 “HiFi 4 memoq mag"
Table 9
Section 1012.7 access. See Section 10.12.10
Section 10126
Section 1012.6 7 Section 10.12.10 7
Section 1012.7 7
Section 1012.6
Section 1012.6
Section 1012.7 access. See Section 10.12.10
Section 1012.6
Section 10.12.10
Section 10.12.10
Section 10.12 6
Section 10.12.10 7
Section 1012.7 7
Section 1012.6
Section 1012.6 Section 10.12.10
Section 10.1 a Section 10.12.10 7
Section 10129 Section 10.12.10 7
Section 1012.8
Section 1012.9

Table 10
Section 10.125
0,
Table 11
Table 11
Seclion 10.123
Table 12
Section 10.12.10.1
Section10.12.10.1
Table 13
Table 14

Table 15
11,
Table 15
Remark
Semion 16.5
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Table 16
Table 17
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Table 30
Table 30
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RELEASED FOR EXTERNAL ASSEMBLY ONLY. THIS DESIGN ONLY MEETS EXTERNAL DESIGN AND ASSEMBLY RULES,
MUST BE REVIEWED AND UPDATED BEFORE BEING ASSEMELED INTERNALLY,
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MECHANICAL 0U TLINE mumm; nnwm Nuum msm. ms
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DEVELOPMENT EFFORT WTLL STTLL BE REQUTRED BY END USERS TO OPTTMTZE PCB MOUNTTNG
PROCESSES AND BOARD DESTGN TN ORDER TO MEET TNDTVTDUAL/SPECTPTC REOUTREMENTS.
© NXF av. ALL HTGHTS RESERVED
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DATE: Is NOV 2mg
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DATE: Ia Nov 20Is
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NOTES:
I. ALI. DIMENSIONS IN MILLIMETERSA
2, DIMENSIONING AND TOLERANCING PER ASME Y14L5M—I994L
PIN AT FEATURE SHAPE, SIZE AND LOCATION MAY VARY.
SOLDIER BALLS.
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OF PACKAGE
MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM C.
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SOT200371
DATE: 19 NOV 2015
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© NXP av. ALL mews RESERVED
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SOLDER MASK OPEN‘NG PATTERN
DATE 24 APR 2mg
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PROCESSES AND BOARD DESTGN TN ORDER TO MEET TNDTVTDUAL/SPECTETC REOUTREMENTS,
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TDX 055
10X 035
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THTS SHEET SERVES ONLY AS A OUTOELTNE To HELP DEVELOP A USER SPECTETC SOLOTTON.
DEVELOPMENT EFFORT WTLL STTLL EE REQUTREO BY END USERS TO OPTTMTZE PCB MOUN‘HNG
PROCESSES AND BOARD DESTGN TN ORDER TO MEET TNDTVTDUAL/SPECTFTC REOOTREMENTS.
© NXP a.V ALL RTcHTs RESERVED DATE 24 ARR 2mg
MECHANTCAL OUTLTNE swam mums was: mm
RRTNT VERsToN NDT To SCALE NON JEDEC BSASAOTSEQD X0
NOTES
L ALL DWENS‘ONS \N M‘LL‘METERS.
2. DTMENSTONTNG AND TOLERANCTNG PER ASME YT4.5M71994,
PW AT FEATURE SHAPE, STZE AND LUCATTON MAY VARY.
A MAX‘MUM SOLDER‘ BALL D‘AMETER MEASURED PARALLEL TO DATUM C.
9}?
DATUM C. THE SEA‘HNG PLANE. TS DETERMTNED BY THE SPHERTCAL CROWNS OF THE SOLDER BALLS
6. THTS PACKAGE HAS A BACK STDE COATTNG THTCKNESS OF 0025.
© NXP av ALL mcHrs RESERVED DATE. 24 APR 2mg
MECHANTCAL OUTLTNE swam nuwwl: Wm mm
PR‘NT VEnsToN NDT m SCALE NON JEDEC BSASAOTSEQD X0
http://www.nxp.com/documents/technical note/TN00009.pdf
' Table 20 “General ogerating conditions"
Section 13.2 “Power Sequencing"
' Table 20 “General operating conditions“ Table 21 “General operating
conditions"
' Section 14.12 “FlexSPl flash interface”
Section 16.4
“RTC oscillator“ Section 16.5 “XTAL oscillator'
aled Table 4 “Pin descrigtion'
Section 15.2 “Temperature sensor“ Section 16.1 “Current
consumgtion vs Memog Panitions'

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